Products

A golf aid that modifies the swing using muscle memory Advanced sensors measure everything from arm acceleration to the exact position of the hand. Collects data associated with an app in the phone where you can read the swing.

We understand the importance of cost efficiency for our clients. With the assistance of our proprietary database (RSS) that continuously is updated with market intelligence and pricing data, we can swiftly analyze the customer’s requirements and propose cost-saving actions. Our proposal often includes several components, such as leveraging market fluctuation opportunities, alternative supply chain, value engineering analyses and replacements from our own line card.

Bredengen offers a wide range of RF couplers, splitters, combiners, and hybrid solutions from both Huber+Suhner and RLC Electronics. This covers needs from mobile base stations and indoor coverage to advanced RF systems in defense, radar, laboratories, and high-frequency microwave applications.

Apart from offering standardized products Swelex specializes in designing and manufacturing customized cable assemblies tailored to your needs. With our experience we guide you through the entire development process, from idea to finished product. Committed to quality, we provide both standard and customized solutions to meet your specific requirements, whether for applications in Industrial, Measurement Instruments, Surveillance, IT, Telecom, HVAC, Automotive, Defense, Aerospace, Medical, and more.

Heat sinks are for dissipating heat where there is a risk of components overheating. Coolers are often used where high power semiconductors need to be cooled. An important area is in lighting with LED technology, where it is absolutely decisive for the product's lifespan. Our manufacturing processes are; "stamping, extrusion, forging" and "skiving". Our heat sinks are customized. In order to give you a price and proposal, we would like to have a drawing, preferably in 3D format. Please contact us for more details. info@multicomponent.se

Customized, exacting and reliable Products from NEOSID — that means high-quality components and innovative manufacturing concepts. With our special manufacturing processes, we mold ferrite into the most complex shapes imaginable. And that means you don’t have to buy “off the shelf” from us. In addition to tested, standardized solutions, we also always offer our customers individual designs and come up with creative new developments in cooperation with you. The products you’ll find on our website are — so to speak — only the beginning. For our team of natural scientists, engineers and technicians will be happy to support you when it’s a matter of customized solutions for your individual needs. To do this, we make use of our wealth of experience from many years of partnerships, including in the automotive, industrial electronics, telecommunications, and medical and heavy-duty sectors. Challenge us and tell us about your special requirements for our products! We’ll be happy to support you in realizing your ideas.

ACTEC offers a wide range of tailor-made solutions for battery packs that meet all the customer's energy needs. The requirements of the application, such as charging options, available space and operating conditions, determine the type of battery chemistry, number of cells and the shape of the battery pack. We have extensive experience in designing battery packs, and perform analyses that ensure optimal service life, including functional tests, climate tests in stressful environments and thermography analysis to map heat generation and the battery pack's ability to get rid of heat.

We are part of the group defining the requirements related to cybersecurity and RED What we can offer: Evaluation of documentation Risk analysis Conformance assessments Product evaluation Regulatory compliance

- 3-slot mainframe with USB, LAN and GPIB interfaces - 6 1/2-digit (22-bit) internal DMM, scanning up to 450 channels per second with new solid-state multiplexer module - 9 switch and control plug-in modules to choose from - 24-bit sampling rate of 800 kSa/s with a new DAQM909A 4 channel digitizer module - Built-in signal conditioning measures thermocouples, RTDs and thermistors, AC/DC volts and current; resistance, frequency/period, diode test and capacitance - 100k readings of non-volatile memory holds data when power is removed - Hi/LO alarm limits on each channel, plus 4 TTL alarm outputs - A BenchVue software license (BV0006B) is now included with your instrument. BenchVue makes it simple to connect, control instruments, and automate test sequences

Phoenix Contact is consistently developing its portfolio of data connectors for reliable communication. With the extension of the product range, established data connectors such as D-SUB are just as much part of the portfolio as new data connectors for RJ45, USB, HDMI, coaxial and fiber optic connections, and Single Pair Ethernet. With the variety of designs, codings, and pin assignments, Phoenix Contact provides a consistent solution for copper or FO cabling. The product program for RJ45 includes both versions for use in office and building applications as well as products that enable reliable data transmission in industrial areas. Particular focus was placed on the development of new solutions for Single Pair Ethernet. The IP20 portfolio for SPE includes pre-assembled patch cables in various lengths, as well as compact device connections for the reflow soldering process in various designs. The latest member of the family is a connector designed for field assembly with IDC insulation displacement connection. The IP-protected portfolio in the M8 design also includes pre-assembled patch cables with various cable types for different applications and device connections in the standard M8 design. All connectors from Phoenix Contact are ideal for reliable and long-lasting device communication. The quality of the product is confirmed by laboratory tests that go beyond the standard and international approvals.

nJet® 388 CRD is developed primarily for the removalof solder pastes and SMT adhesives from stencils, PumPrints,squeegees and misprints. The cleaning system can also be used for PCB cleaning, or for a combination of PCB cleaning and the afore-mentioned cleaning processes. The machine can also be used for the removal of cured conformal coating.

Underfill är en specialiserad inkapslingsmetod som används inom mikroelektronik för att förbättra tillförlitligheten hos lödförbindelser mellan komponenter såsom flip-chips eller BGA:er och deras substrat. Genom att fylla utrymmet mellan chipet och substratet med ett underfill-lim minskas den mekaniska påfrestning som orsakas av skillnader i termisk utvidgning, vilket förhindrar sprickbildning och förlänger komponentens livslängd. Vad är underfill? Underfill-processen innebär applicering av ett lågvisköst lim som genom kapillärverkan tränger in under komponenten och fyller mellanrummet mellan chip och substrat. Efter härdning bildar limmet en solid förbindelse som: Fördelar den mekaniska belastningen jämnt över lödförbindelserna Förbättrar termisk och mekanisk stabilitet Ökar motståndskraften mot vibrationer och termiska cykler Förlänger komponentens livslängd