conga-TCRP1 combines high performance with maximum scalability and design flexibility

Scalable Edge Performance for Demanding Applications

congatec – the leading vendor of embedded and edge computing technology – is enhancing the performance and scalability of its AMD Ryzen™ AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules. The conga-TCRP1 is now available in six new variants with eight, ten, or twelve CPU cores. This makes them an ideal fit for cost-sensitive designs that require a highly flexible and scalable embedded computing platform. Developers can now seamlessly scale from 4 to 12 CPU cores and from 2 to 16 graphics compute units, achieving an optimized balance of CPU, GPU, and NPU resources.

Customers can use just one module variant for various designs, ranging from passively cooled, fully enclosed designs for robust handheld devices and hygienic medical PCs to mission computers for harsh environments and high-performance system designs.

The new COM Express compact modules leverage the advanced AMD “Zen 5” and “Zen 5c” CPU architecture with 4-nm technology to deliver enhanced determinism for real-time and latency-sensitive workloads. Additional performance gains are achieved through the integrated Radeon RDNA 3.5™ GPU and the XDNA2™ NPU with up to 50 TOPS of AI compute capability. This powerful computing architecture accelerates performance-intensive and deterministic edge AI applications across industries including transportation, medical technology, smart city infrastructure, gaming, robotics, and industrial automation.

High compute density particularly benefits mobile medical imaging devices such as ultrasound systems, AI-powered industrial machine vision solutions for automated quality inspection, as well as traffic monitoring and surveillance systems in smart cities including extended temperature deployments for wayside installations. The modules are also ideally suited for professional gaming applications.