congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications

The modules in detail

For new designs requiring the highest data-throughput with PCIe Gen 5 and USB4, the COM-HPC Mini conga-HPC/mPTL and COM-HPC Client conga-HPC/cPTL modules deliver extreme performance and I/O bandwidth. For all existing COM Express Type 10-based mission-critical applications the credit-card sized conga-MC1000 is an ideal upgrade. The conga-TC1000 COM Express Compact module targets legacy cost-sensitive systems in need of technology refresh, and the ruggedized conga-TC1000r with screw-locked LPCAMM2 memory is aimed at rugged applications.

All COMs are powered by the Intel Core Ultra Series 3 processors, built on Intel 18A, and can scale up to Intel Core Ultra X9 or X7 processors with up to 4 P-cores, up to 8 E-cores and up to 4 LP E-Cores. Designers can work with up to 96 GB of soldered-down LPPDR5X memory or socketed LPCAMM2 memory on selected SKUs with optional in-band Error Correction Code (ECC) for mission-critical applications. The integrated graphics with Intel Xe-Display-Engine supports up to 3 independent 6K displays.

Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, ctrlX OS, Ubuntu Pro, Kontron OS, Linux, and Yocto. As application-ready aReady.COMs, they can be pre-configured with licensed ctrlX OS, Ubuntu Pro, and KontronOS. The aReady.VT option with integrated hypervisor-on-module allows developers to consolidate multiple workloads, such as real-time control, HMI, AI, and IoT gateway functions on a single module. For IIoT connectivity, congatec offers its aReady.IOT software building blocks, which enable data exchange, maintenance/management of the module, carrier, and peripherals, as well as cloud connectivity upon request. To further simplify application development, congatec provides an extensive ecosystem that includes evaluation and production-ready carrier boards, customized cooling solutions, comprehensive documentation, design-in services, and high-speed signal integrity measurements.