congatec tar inbyggda ARM-moduler till en ny prestandanivå

Robust, compact, and AI-optimized

With a form factor roughly the size of a credit card, the conga-HPC/mIQ-X features a robust design with soldered, fast LPDDR5X RAM and support for an industrial temperature range from -40 °C to +85 °C.

Typical use cases include video surveillance, sensor and camera systems for edge analytics, and applications with local AI processing. This platform is ideal for developers who want to leverage the strengths of Arm on Microsoft Windows. It significantly reduces development time compared to other implementations through simplified software integration and UEFI-compatible firmware. All size, weight, and power (SWaP) optimized designs also benefit from the high performance per watt of the new mini modules.

“The conga-HPC/mIQ-X takes embedded Arm computing to a new level of performance and simplifies the development of AI-accelerated edge and vision systems through UEFI BIOS support, Windows integration, and a complete ecosystem,” explains Konrad Garhammer, COO and CTO of congatec.

Feature set in detail

The conga-HPC/mIQ-X COM-HPC Mini module - measuring just 95 mm x 70 mm - is based on Qualcomm Dragonwing IQ-X Series processors with up to 64 GB of LPDDR5X memory. With up to 12 Oryon cores, a dedicated Hexagon NPU, DSP, and Qualcomm® Spectra ISP, it offers optimized computing units for ultra-efficient processing of video, image, and audio data. The integrated Qualcomm ® Adreno™ GPU delivers powerful graphics, supporting up to 3 displays and 8K resolution. For fast networking and peripheral connectivity, the COM-HPC Mini module offers 2x 2.5 Gb Ethernet, up to 16x PCIe Gen3/Gen4 lanes, 2x USB4, 2x USB3.2 Gen2x1, and 8x USB2.0. Graphics output is via 2x DDI and eDP, and up to 4 cameras can be connected directly via MIPI CSI. 2x I2C, 2x UART, and 12x GPIO round out the feature set. The integrated TPM 2.0 module serves as the hardware root of trust.