NXP MPC860 and MPC855 Processors - Long Term Built

Rochester Electronics and NXP Semiconductors have partnered together to continue the MPC860/MPC855 product family beyond the NXP published last-ship date.
These versatile microprocessors are based on PowerPC cores and include multiple peripheral
blocks including several adapted from previous NXP Quad Integrated Communications Controller devices and are ideal for use in communications and networking applications. They have been in production for over two decades, with many uses in long lifecycle applications. Through an exclusive NXP factory EOL die purchase, along with assembly and test licensing, Rochester will be supplying drop-in replacement and pin-compatible solutions beyond the NXP published last-ship date, December 1, 2023. These devices will be built from NXP-originated die and licensed assembly and test program specifications, providing a drop-in replacement that requires no design modifications.