Boliden Bergsøe A/S
About us
With a focus on the Nordic electronic market, Boliden Bergsøe A/S has invested a lot in new products and further development of good existing tin alloys, tin wire, flux and solder paste for circuit board manufacturing, but also a lot of focus is on tin recycling. Our local unit in Glostrup, Denmark is responsible (and has the agency for Tamura Elsold GmbH) for, among other things, the sale of tin in the Nordics and the buyback of tin waste, more information can be found under our own new website www.boliden.dk
For the past 10 years, Boliden Bergsøe A/S has gained market shares in the electronics market every year with Tamura Elsold's microalloyed tin SN100 MA-S and is growing every year. Now there is also the newly developed alloy SN100 PS, specially developed for selective soldering and is very cost-effective without silver content. A new pasta factory was also built in 2019 and there a range of new pastas have been developed and we will have a representative from Tamura Elsold GmbH at the fair to tell us more about these. Welcome to visit our booth and will tell you more
Products & services
Solderingtin leadfree SN100MA-S microalloy
Microalloyed tin that has a very high degree of purity, lower oxidation, lower viscosity and produces shiny fine solders. The new generation of lead-free tin
Soldertin leadfree SN100 MA-B Microalloy
Selective soldering tin leadfree SN100 PS Microalloy
A newly developed tin alloy specially developed for selective soldering which, like SN100 MA-S, has undergone the same purification process, but it does not attack the nozzle and runs 60% less risk of solder joints and "spikes". Also available in silver alloy.
Solderpaste TLF-204-111M
A lead-free solder paste containing spherical solder powder and special flux. Safety verified by Siemens CT
Flux Tamura Elsold 1025 NC
ELFLUX 1025 NC is a solvent-based, halide-free, organic no-clean flux for use in wave and selective soldering. It is low in solids and is free from rosin. The flux leaves practically no residues and cleaning is in general not necessary. Residues on the boards, if any, are not tacky. Electronic in-circuit-testing is possible without causing any problems. High surface insulation resistance values can be achieved by virtue of the low solid content of ELFLUX 1025 NC. Also in tests according to Fraunhofer IZM/ZVE procedure for selective soldering not electro migration occurs. ELFLUX 3007 NC is a water-based, halide-free, organic no-clean flux for use in wave and selective soldering. I t is low in solid content. ELFLUX 3007 NC is a further development of the ELFLUX 3000 series with the objective to further reduce the flux residues after soldering and also to improve the activity. The few remaining residues on the boards are not tacky and cause no problem during electrical in-circuit testing. Cleaning of the boards to remove the residues from the solder joints is in general not required. Also in tests according to Fraunhofer IZM/ZVE procedure for selective soldering not electro migration occurs.
Tinwire leadfree with new X-flux
• Works with all known lead-free alloys • Fast and stable wetting • Up to 90% less splash than normal tin wire • Bright, transparent residue - no dark discoloration • Several different alloys are available and other series
